About HFC

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Hangzhou HFC Semiconductor (杭州积海半导体有限公司) was established on September 6th, 2019 and is headquartered in Qiantang District, Hangzhou, China.  HFC positions itself as a semiconductor service provider in China and offers manufacturing process technologies, testing services and IP services. 

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In November 2021, HFC had the initial groundbreaking at its Hangzhou site.  Within its 181-acres land parcel in Hangzhou, China, HFC plans to build a 12-inch wafer fab with two phases, a total of planned capacity over 80 kWPM (thousand wafer per month) when fully constructed.

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HFC plans to offer and support customers with 55nm (nanometer) and 28nm (nanometer) semiconductor process technologies and cover a variety of end market applications including consumer electronics, wireless connectivity and Internet of Things (IoT).