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About HFC

Hangzhou HFC Semiconductor (杭州积海半导体有限公司) was established on September 6th, 2019 and is headquartered in Qiantang District, Hangzhou, China.  HFC positions itself as a semiconductor service provider in China and offers manufacturing process technologies, testing services and IP services. 

In November 2021, HFC had the initial groundbreaking at its Hangzhou site.  Within its 181-acres land parcel in Hangzhou, China, HFC plans to build a 12-inch wafer fab with two phases, a total of planned capacity over 80 kWPM (thousand wafer per month) when fully constructed.

HFC plans to offer and support customers with 55nm (nanometer) and 28nm (nanometer) semiconductor process technologies and cover a variety of end market applications including consumer electronics, wireless connectivity and Internet of Things (IoT).

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